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PTC Connects Onshape CAD with NVIDIA Isaac Sim in Robotics Design-to-Simulation Workflow

Nitin Patil - 0
BOSTON, MA, USA, Mar 19, 2026 – PTC (NASDAQ: PTC) today announced a new robotics design-to-simulation workflow that connects PTC’s cloud-native Onshape computer-aided design (CAD) and product data management...
CAE

Synopsys Launches Ansys 2026 R1 to Re-Engineer Engineering with Joint Solutions and AI-Powered Products

Sachin R Nalawade - 0
Release combines AI, multiphysics simulation, and real-world digital twin technology to transform how teams explore designs, validate earlier, and engineer smarter, more resilient systems Key...

DST Releases Working Model 2D V10 for 2D Kinematic, Dynamic Simulation

Gamma Technologies Unveils GT Intelligence Studio, Strengthens Leadership Team

SPDM (Simulation Process and Data Management): The Backbone of Modern Digital Engineering

Mexico-based COATL Engineering to Offer ENGYS’ HELYX, ELEMENTS across Latin America

CASE STUDY | Watch Now | Mold Industry

3D Printing

3D Printing

TPM3D Unveils Three New SLS 3D Printing Solutions at TCT Asia 2026

Nitin Patil - 0
SHANGHAI, China, Mar 31, 2026 – TPM3D announced three major product launches at TCT Asia 2026, reinforcing its position in selective laser sintering (SLS) innovation and full-process...

Tekna Secures CAD 1.5 Million Plasma Systems Order from UK University

Velo3D Appoints James Suva as CFO

3D Systems Appoints Phyllis Nordstrom as Chief Financial Officer

BMF Launches microArch S150 Series 3D Printers

Tekna, Farsoon Strengthen Collaboration to Industrialize Ti-6Al-4V Powders for PBF-LB Manufacturing

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3D CAD

What to Check Before Purchasing 3D CAD or CAE Software from a Reseller

Sachin R Nalawade - 0
Investing in 3D CAD or CAE software is a strategic decision that goes far beyond simply selecting a tool—it directly impacts your engineering efficiency,...

SOLIDWORKS for Startups: Driving Faster Product Development and Innovation

BEACON India: Emerging as the Best Formlabs 3D Printer & Material Reseller in India

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3D Product Architect in the 3DEXPERIENCE

MFG Tech Update

WiCAM Develops New Post-Processor for HSG X2512 Laser Cutting Machine

Nitin Patil - 0
PFINZTAL-SOLLINGEN, Germany, Apr 6, 2026 – In the first quarter of 2026, WiCAM developed a new post-processor for the HSG X2512 laser machine with 6...

Hexagon Introduces New ESPRIT EDGE Capabilities to Reduce CNC Programming Effort, Support High Complexity Machining

Nitin Patil - 0
COBHAM, London, Apr 6, 2026 – Hexagon announces new capabilities in ESPRIT EDGE, designed to reduce CNC programming effort, improve process predictability, and help manufacturers...

Titomic Receives AU$1.7 Million Cold Spray AM Systems Order from Royal NLR

Nitin Patil - 0
HEERENVEEN, The Netherlands, Apr 3, 2026 – Titomic Limited (ASX: TTT), a global advanced manufacturing company serving the U.S. and allied defense industrial base, is...

AML3D Receives AU$2.6 Million Order for US Navy Submarine Parts

Nitin Patil - 0
EDINBURGH, Australia, Apr 3, 2026 – AML3D Limited (ASX:AL3) ("AML3D" or "the Company") is pleased to announce an order for high demand, non-safety critical replacement...

Renishaw Expands German Service Centre to Strengthen European Customer Support

Nitin Patil - 0
GLOUCESTERSHIRE, UK, Apr 3, 2026 - Renishaw, a global leader in engineering technologies, has completed a major expansion and refurbishment of its German customer...

EDA

Cadence Launches ChipStack AI Super Agent for Chip Design, Verification

Nitin Patil - 0
AI
SAN JOSE, CA, USA, Feb 17, 2026 — Cadence (Nasdaq: CDNS) announced a transformative step forward in redefining how semiconductors are designed with the launch...

Toshiba to Use Siemens’ EDA Software for Semiconductor Design Innovation

Nitin Patil - 0
Design News
PLANO, TX, USA, Dec 17, 2025 - Siemens, a leading technology company, announced that Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has introduced Siemens’...
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