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SimScale Opens Engineering AI Agents to All Enterprise Teams

Nitin Patil - 0
MUNICH, Germany, May 25, 2026 — SimScale, the AI-native cloud platform for engineering simulation, opened enterprise waitlist access to its guided pilot service for Engineering AI agents —...
CAE

BETA CAE Systems Releases 2025.1HF2 for ANSA, EPILYSIS, META, FATIQ, KOMVOS

Nitin Patil - 0
LUCERNE, Switzerland, Apr 23, 2026 – BETA CAE Systems is pleased to announce the release of 2nd Hot Fix of 2025.1 for ANSA, EPILYSIS, META, FATIQ,...

DEP Launches AIWorks, an AI-Powered Engineering Platform Integrating Machine Learning and Simulation

2026 ESTECO International Users’ Meeting Dates and Keynotes Speakers Announced

DEP MeshWorks & AIWorks Conclave 2026 – Pune: A Glimpse into the Future of AI-Driven Engineering

PTC Connects Onshape CAD with NVIDIA Isaac Sim in Robotics Design-to-Simulation Workflow

CASE STUDY | Watch Now | Mold Industry

3D Printing

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SOLIDWORKS

SOLIDWORKS - BEACON India

3D Printing

BEACON India Brings Advanced Formlabs 3D Printing Experience Center to Bengaluru

Sachin R Nalawade - 0
As Bengaluru and Karnataka continue to strengthen their position as India’s leading hubs for manufacturing innovation, product engineering, aerospace, automotive, healthcare, electronics, and deep-tech...

Automation Intelligence: Focuses on the “Smart” Side of the Rules Engine

Design at the Speed of Thought: Boosting Output with Algorithmic Design

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3D Product Architect in the 3DEXPERIENCE

MFG Tech Update

ROBOZE, SUPSI Collaborate on High-Performance Materials Research

Nitin Patil - 0
BARI, Italy, May 28, 2026 - ROBOZE, the foundational advanced manufacturing layer for the world’s mission-critical industries, announces a collaborative research and development initiative...

Lufthansa Technik to Acquire Additional Cold Spray AM Technology from Titomic

Nitin Patil - 0
HUNTSVILLE, AL, USA, May 27, 2026 – Titomic Limited (ASX: TTT), a global advanced manufacturing company serving the U.S. and allied industrial base, using its...

SCANOLOGY Launches AccuArm Portable CMM

Nitin Patil - 0
HANGZHOU, China, May 27, 2026 — As manufacturing environments become increasingly complex, quality teams need measurement systems that are not only accurate, but also...

America Makes Announces Winners of JAQS-SQ Project Call Worth $1.7M

Nitin Patil - 0
YOUNGSTOWN, OH, USA, May 26, 2026 — America Makes and the National Center for Defense Manufacturing and Machining (NCDMM) are proud to announce the winners of...

DMG MORI Expands Solution Portfolio with SolidCAM

Nitin Patil - 0
SCHRAMBERG, Germany, May 26, 2026 - DMG MORI Technium is expanding its CAM software solution portfolio to include SolidCAM, enabling customers to benefit from an...

EDA

Cadence Launches ChipStack AI Super Agent for Chip Design, Verification

Nitin Patil - 0
AI
SAN JOSE, CA, USA, Feb 17, 2026 — Cadence (Nasdaq: CDNS) announced a transformative step forward in redefining how semiconductors are designed with the launch...

Toshiba to Use Siemens’ EDA Software for Semiconductor Design Innovation

Nitin Patil - 0
Design News
PLANO, TX, USA, Dec 17, 2025 - Siemens, a leading technology company, announced that Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has introduced Siemens’...
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