Moldex3D Exhibits at DAC 2014 and Unveils New IC Packaging Simulation Features
May 21, 2014- Hsinchu, Taiwan- CoreTech System (Moldex3D) is happy to announce that we will be returning back to exhibit at this year’s Design and Automation Conference (DAC 2014) from June 2 to June 4, 2014 in San Francisco, CA. At this year’s event, Moldex3D will demonstrate the strong capabilities of our simulation solutions, and unveil the latest Moldex3D features for IC Packaging industry.
Moldex3D IC Packaging
Moldex3D offers a comprehensive suite of simulation solutions for IC Packaging, ensuring validation and optimization of a complex microchip encapsulation process, in which a proper runner and gate design is also included and verified. With pioneering 3D dynamic flow visualization technology, potential defects such as wire sweep, paddle shift, voids, and warpage can be predicted and well-addressed upfront prior to actual manufacturing.
The Moldex3D IC Packaging module is a fully integrated analysis environment connecting pre-processing, post-processing, packaging simulation and structural analyses for microchip encapsulation. One of the major challenges for 3D modeling of microchip encapsulation is generating a suitable mesh for simulation analysis. In Moldex3D pre-processor, an efficient mesh generator with high-quality and arbitrary grid type (for example, tetra, hexa, wedge, pyramid or boundary layer elements) allows meshing of the complete package geometry with minimal model simplification. In addition, a parametric capability facilitates a proper mesh creation for delicate IC wires, thereby greatly saving time and efforts spent on mesh preparation. Furthermore, Moldex3D can calculate the resin flow considering nonlinearities such as viscosity change of epoxy molding compound during both in-mold and post-mold curing process.
Highlights on the New Moldex3D Simulation Features for IC Packaging
- Underfill Process: Moldex3D provides a variety of solutions for underfill process from 2.5D to 3D IC stacking, such as Capillary Underfill (CUF), No-flow Underfill (NUF), Molded Underfill (MUF), Non-conductive Paste (NCP), Non-conductive Film (NCF), etc., for the growing applications of 3D IC stacking
- Cadence Interface: Moldex3D supports users to import Cadence model (*.3di) directly
- Post-mold Curing Process: Moldex3D provides post-mold curing simulation for warpage validation in IC encapsulation process. Moldex3D accurately controls residual stress and predicts the amount of warpage while considering both thermal and cure shrinkage
Last but not least, Moldex3D cordially encourages all those attending this global DAC Show to stop by our booth at #509 for an informal one-on-one conversation with our representatives on the latest simulation developments for IC Packaging industry.
The Design Automation Conference (DAC) is recognized as the premier conference for design and automation of electronic systems. DAC offers outstanding training, education, exhibits and superb networking opportunities for designers, researchers, tool developers and vendors.
About CoreTech System (Moldex3D) Co., Ltd
CoreTech System (Moldex3D) Co., Ltd. has been providing the professional CAE analysis solution “Moldex” series for the plastic injection molding industry since 1995. Moldex3D IC Packaging provides a comprehensive suite of simulation solutions that help IC designers/engineers simulate the complex chip encapsulation process, validate mold design, and optimize process conditions. It helps designers/engineers fully analyze the microchip encapsulation process from filling, curing, cooling, to advanced manufacturing demands, such as underfill encapsulation, post-molding annealing, stress distribution, and structural evaluation. Significant molding problems can be predicted and solved upfront, which helps engineers enhance microchip quality and prevent potential defects more efficiently.
More info see - http://www.moldex3d.com/en