Deadline to Submit Presentation Abstracts for COMSOL Conference 2019 Bengaluru, India by June 28

Deadline to Submit Presentation Abstracts for COMSOL Conference 2019 Bengaluru, India by June 28

BENGALURU, India, Apr 8, 2019 - COMSOL has announced that the Program Committee for the COMSOL Conference 2019 has begun to accept abstract submissions for posters and papers by 28 June 2019.




Presenters at the COMSOL Conference gain exposure to a worldwide audience, providing them with the opportunity to showcase their work to simulation specialists throughout industry and academia.

“Presenting at the COMSOL Conference is a great opportunity to share our modeling and simulation work with like-minded individuals and gain recognition for our contribution within the simulation community,” said Fritz Lange, Research Associate, Fraunhofer. “Likewise, we learn about many different applications from other engineers and take that inspiration back home to improve on our work directly.”

The papers and posters accepted for presentation will reach approximately 2000 conference attendees across the globe. Additionally, the conference proceedings are then published online for public access, amplifying the reach beyond those directly in attendance.

The COMSOL Conference 2019 Bengaluru will be held 28-29 November 2019, at ITC Gardenia in Bengaluru, Karnataka. For a list of worldwide events and deadlines, visit:

Suggested topic areas for papers and posters include:

  1. AC/DC electromagnetics
  2. Acoustics and vibrations
  3. Batteries, fuel cells, and electrochemical processes
  4. Bioscience and Bioengineering
  5. Chemical reaction engineering
  6. Computational fluid dynamics
  7. Electromagnetic heating
  8. Geophysics and geomechanics
  9. Heat transfer and phase change
  10. MEMS and nanotechnology
  11. Microfluidics
  12. Multiphysics
  13. Optics, photonics, and semiconductors
  14. Optimization and inverse methods
  15. Particle tracing
  16. Piezoelectric devices
  17. Plasma physics
  18. RF and microwave engineering
  19. Simulation methods and teaching
  20. Structural mechanics and thermal stresses
  21. Transport phenomena


COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation applications. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electromagnetics, structural, acoustics, fluid flow, heat transfer, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on COMSOL Compiler and COMSOL Server to deploy applications to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL has 19 offices worldwide and extends its reach with a network of distributors. For more information, visit

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