An Interview with Dr. Vineet Dravid, MD, COMSOL Multiphysics Pvt. Ltd. India
COMSOL, the worldwide leader in Multiphysics simulations recently conducted their COMSOL Conference 2016 in Bangalore. Over 400 delegates attended the event. This annual event serves as a platform for users to understand COMSOL’s product roadmaps, key release highlights, hands-on training sessions and lectures and experts from industry and academia exchange ideas during user presentations, keynote talks, and social events.
I had a chance to meet Dr. Vineet Dravid, MD, COMSOL Multiphysics Pvt. Ltd. India along the sidelines of the conference. Here are some excerpts from the interview.
What are the latest trends, best practices and applications in engineering simulation?
With extremely fast and affordable hardware combined with optimized numerical techniques, simulation is approaching mainstream adoption. Multiphysics simulations can now be accessed by any engineer or designer. Those who don’t have any previous experience using simulation software are now able to access the power of multiphysics, thanks to simulation apps and COMSOL ServerTM.
How can companies adopting simulation early in the design cycle add significant gains on time and cost savings, as well as increase their competitive edge?
Mimicking real life interactions in products requires a multiphysics approach. Adopting numerical simulation at an early stage during the design process enables engineers to perform design optimization faster, reduce the number of physical prototypes, and shorten the time to market.
What is Multiphysics design? How COMSOL Multiphysics software is different from the other simulation tools?
The ability to couple different physical phenomena and model their interaction as it happens in the real world, that’s the multiphysics approach. COMSOL Multiphysics® has been built on that approach from the ground up and supports the simulation of virtually any physics based system thanks to the underlying flexibility made available through the intuitive and easy-to-use COMSOL Desktop® interface. With more than 30 add-on products to choose from, you can further expand the simulation platform with tools for electrical, mechanical, acoustic, fluid flow, thermal, and chemical applications.
Please tell us more about the COMSOL Multiphysics’ Application Builder and Livelink and how they are helpful to users to develop better products?
The Application Builder empowers the design process by allowing engineers to make an easy-to-use simulation app based on their COMSOL Multiphysics model. Any COMSOL Multiphysics model can be turned into an application with its own interface using the Application Builder tool. Based on the project at hand, engineering experts can now easily build a custom user interface to share with their colleagues and customers that includes only the parameters relevant to the design of a specific device or product.LiveLink™ products help the users to combine the strengths of COMSOL Multiphysics with major technical computing and CAD tools.
How can better adoption of simulation cut development cycles, especially in markets like India?
Introducing simulation apps to new and large groups of users boosts productivity through organizations. As India’s tech sector is one of the world’s fastest growing markets, the easy deployment of simulation apps across departments will be of great importance to scale up production of high-tech products while maintaining high quality and aggressive cost control.
What sectors or industries are using COMSOL Multiphysics? Is it more popular in power plants and research (eg. batteries and fuel cells) compared to automotive industry in India?
Given the Multiphysics nature of the software, it is used across industries and even within an industry, across application areas.The COMSOL Conference saw users from the automotive, power, defense and engineering service present work done using COMSOL Multiphysics®.
Does simulation play any role in 3D printing, in mass production done using 3D Printing?
Since 3D printing first emerged as a technology, its impact has been felt across a wide range of industries. Researchers are using multiscale modeling and simulation to investigate virtual material design in 3D printing, as well as optimization of shaped metal deposition (SMD), a 3D metal printing technique. With COMSOL Multiphysics, it is possible to export geometries, meshes, and surface plots in the STL format for printing in 3D. This means you can conceive, design, optimize, and prototype a product using only COMSOL Multiphysics (and/or one of the LiveLink™ products) and a 3D printer.
The Pace of Adoption of the internet of things (IoT) is speeding up, do you think CAE would play a bigger role in IoT?
Making IoT enabled devices and components is a unique design challenge. A couple of major challenges include communication and miniaturization. We need to control “who talks to whom” and electromagnetic interference/compatibility analysis (EMI/ EMC) of these devices will be critical. Similarly light weighting will be another key to a good IoT product. For these and other such challenges, CAE software is going to be indispensable. Further, as hardware continues to become even faster the day is not far when CAE products could be used for real time applications within products for predictive monitoring as well as response.
Going forward, what will be the company’s strategy and roadmap for India?
India is a very important market for COMSOL. There is a growing demand for COMSOL Multiphysics® and simulation apps across industries and academia. We will continue to cater to the Indian market by providing software sales, exceptional technical support, comprehensive training sessions, webinars, user meetings, and customer events.
About Dr. Vineet Dravid.
Dr. Vineet Dravid is the Managing Director of India operations at COMSOL. Prior to this, he worked in the COMSOL’s Boston office assisting customers implement solutions using COMSOL Multiphysics®. He has a BE degree in Mechanical Engineering from RV College of Engineering, Bangalore and a PhD degree, specializing in CFD applications, from Purdue University, USA.