COMSOL Multiphysics v5.0 Launched in India at Bangalore Conference 2014!

From simulation to application: COMSOL® software users can now design specialized applications to provide researchers, designers, and manufacturers with access to the power and accuracy of multiphysi... Read more...

Bentley Issues 2 Industry Insights: Year in Infrastructure Conference 2014

Bentley Systems has issued 2 new industry insights based on their recently concluded Year In Infrastructure Conference at London witnessing gathering of leading AEC executives, infrastructure owner-op... Read more...

Integrating CAE Simulation and FEA to Make Lightweight and Strong Parts

With the growing demand for lightweight designs and composite material applications, part designers and engineers across different industries had been challenged to search for a more innovative yet ec... Read more...

Analysis on Mold Deformation Behavior is now Available on Mold-Filling Simulation Software

During injection molding process, the mold base and its components would have to withstand several external loading issues; the temperature and the pressure, for instance, are two major influential ef... Read more...

COMSOL Multiphysics v5.0 Launched in India at Bangalore Conference 2014!

COMSOL Multiphysics v5.0 Launched in India at Bangalore Conference 2014!

25/11/2014, 0 comments
Bentley Issues 2 Industry Insights: Year in Infrastructure Conference 2014

Bentley Issues 2 Industry Insights: Year in Infrastructure Conference 2014

18/11/2014, 0 comments
Integrating CAE Simulation and FEA to Make Lightweight and Strong Parts

Integrating CAE Simulation and FEA to Make Lightweight and Strong Parts

13/11/2014, 0 comments
Analysis on Mold Deformation Behavior is now Available on Mold-Filling Simulation Software

Analysis on Mold Deformation Behavior is now Available on Mold-Filling Simulation Software

27/10/2014, 0 comments

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